Why is gallium arsenide (GaAs) useful for semiconductor devices operating at UHF and higher frequencies?

1. A Higher noise figures
2. B Higher electron mobility
3. C Lower junction voltage drop
4. D Lower transconductance

Which of the following device packages is a through-hole type?

1. A DIP
2. B PLCC
3. C BGA
4. D SOT

Which of the following materials supports the highest frequency of operation when used in MMICs?

1. A Silicon
2. B Silicon nitride
3. C Silicon dioxide
4. D Gallium nitride

Which is the most common input and output impedance of MMICs?

1. A 50 ohms
2. B 300 ohms
3. C 450 ohms
4. D 75 ohms

Which of the following noise figure values is typical of a low-noise UHF preamplifier?

1. A 0.5 dB
2. B -10 dB
3. C 44 dBm
4. D -20 dBm

What characteristics of MMICs make them a popular choice for VHF through microwave circuits?

1. A The ability to retrieve information from a single signal, even in the presence of other strong signals
2. B Extremely high Q factor and high stability over a wide temperature range
3. C Nearly infinite gain, very high input impedance, and very low output impedance
4. D Controlled gain, low noise figure, and constant input and output impedance over the specified frequency range

What type of transmission line is often used for connections to MMICs?

1. A Miniature coax
2. B Circular waveguide
3. C Parallel wire
4. D Microstrip

How is power supplied to the most common type of MMIC?

1. A Through a capacitor and RF choke connected to the amplifier input lead
2. B MMICs require no operating bias
3. C Through a resistor and/or RF choke connected to the amplifier output lead
4. D Directly to the bias voltage (Vcc) lead

Which of the following component package types have the least parasitic effects at frequencies above the HF range?

1. A TO-220
2. B Axial lead
3. C Radial lead
4. D Surface mount

What advantage does surface-mount technology offer at RF compared to using through-hole components?

1. A Smaller circuit area
2. B Shorter circuit board traces
3. C Components have less parasitic inductance and capacitance
4. D All these choices are correct

What is a characteristic of DIP packaging used for integrated circuits?

1. A Extremely low stray capacitance (dielectrically isolated package)
2. B Extremely high resistance between pins (doubly insulated package)
3. C Two chips in each package (dual in package)
4. D Two rows of connecting pins on opposite sides of package (dual in-line package)

Why are DIP through-hole package ICs not typically used at UHF and higher frequencies?

1. A Excessive dielectric loss
2. B Epoxy coating is conductive above 300 MHz
3. C Excessive lead length
4. D Unsuitable for combining analog and digital signals