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E6E10

CIRCUIT COMPONENTS · Semiconductor materials and packages for RF use

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What advantage does surface-mount technology offer at RF compared to using through-hole components?

  1. ASmaller circuit area
  2. BShorter circuit board traces
  3. CComponents have less parasitic inductance and capacitance
  4. DAll these choices are correct
Why Surface-mount parts sit directly on the board pads with no wire leads passing through holes, so all three benefits apply at once. The tiny packages let a given circuit occupy less board area, which in turn shortens the traces between stages, and the absence of long leads removes the series lead inductance and stray pad-to-lead capacitance that degrade performance as frequency rises. At VHF, UHF and microwave, even a few nanohenries of lead inductance can detune a circuit, so SMT is the norm for modern RF design.
Watch out Each individual benefit listed is true on its own, so picking just the smaller area or just the shorter traces leaves out equally valid advantages; the parasitic reduction is actually the most important one at RF.
No leads means no lead inductance: SMT wins on size, trace length and parasitics all at once.
HamSandwich explanation, first draft. The question and answers are the NCVEC text.
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The rest of E6E

  1. E6E01 Why is gallium arsenide (GaAs) useful for semiconductor devices operating at UHF and higher frequencies?
  2. E6E02 Which of the following device packages is a through-hole type?
  3. E6E03 Which of the following materials supports the highest frequency of operation when used in MMICs?
  4. E6E04 Which is the most common input and output impedance of MMICs?
  5. E6E05 Which of the following noise figure values is typical of a low-noise UHF preamplifier?
  6. E6E06 What characteristics of MMICs make them a popular choice for VHF through microwave circuits?
  7. E6E07 What type of transmission line is often used for connections to MMICs?
  8. E6E08 How is power supplied to the most common type of MMIC?
  9. E6E09 Which of the following component package types have the least parasitic effects at frequencies above the HF r…
  10. E6E10 What advantage does surface-mount technology offer at RF compared to using through-hole components?
  11. E6E11 What is a characteristic of DIP packaging used for integrated circuits?
  12. E6E12 Why are DIP through-hole package ICs not typically used at UHF and higher frequencies?
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