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E6E11

CIRCUIT COMPONENTS · Semiconductor materials and packages for RF use

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What is a characteristic of DIP packaging used for integrated circuits?

  1. AExtremely low stray capacitance (dielectrically isolated package)
  2. BExtremely high resistance between pins (doubly insulated package)
  3. CTwo chips in each package (dual in package)
  4. DTwo rows of connecting pins on opposite sides of package (dual in-line package)
Why DIP stands for Dual In-line Package, and the name describes the physical layout: the plastic or ceramic body has two parallel rows of pins running down opposite long sides, spaced 0.1 inch apart, meant to be inserted through holes in a circuit board or into a socket. The word 'dual' refers to the two rows of leads, not to anything electrical inside the chip. DIPs are through-hole parts, in contrast to surface-mount packages like SOIC, SOT and leadless chip carriers that are preferred at VHF and above because of their shorter leads.
Watch out The choice about two chips in one package misreads 'dual' as counting dies; a DIP normally holds a single die, and the lead inductance of those long pins actually makes DIPs worse, not better, for stray reactance at RF.
DIP = Dual In-line Package: two in-line rows of pins, one down each side.
HamSandwich explanation, first draft. The question and answers are the NCVEC text.
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The rest of E6E

  1. E6E01 Why is gallium arsenide (GaAs) useful for semiconductor devices operating at UHF and higher frequencies?
  2. E6E02 Which of the following device packages is a through-hole type?
  3. E6E03 Which of the following materials supports the highest frequency of operation when used in MMICs?
  4. E6E04 Which is the most common input and output impedance of MMICs?
  5. E6E05 Which of the following noise figure values is typical of a low-noise UHF preamplifier?
  6. E6E06 What characteristics of MMICs make them a popular choice for VHF through microwave circuits?
  7. E6E07 What type of transmission line is often used for connections to MMICs?
  8. E6E08 How is power supplied to the most common type of MMIC?
  9. E6E09 Which of the following component package types have the least parasitic effects at frequencies above the HF r…
  10. E6E10 What advantage does surface-mount technology offer at RF compared to using through-hole components?
  11. E6E11 What is a characteristic of DIP packaging used for integrated circuits?
  12. E6E12 Why are DIP through-hole package ICs not typically used at UHF and higher frequencies?
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