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E6E07

CIRCUIT COMPONENTS · Semiconductor materials and packages for RF use

E6E07E6E →

What type of transmission line is often used for connections to MMICs?

  1. AMiniature coax
  2. BCircular waveguide
  3. CParallel wire
  4. DMicrostrip
Why MMICs are surface-mount microwave chips, and the interconnects on the circuit board must be controlled-impedance transmission lines (usually 50 ohms) right up to the package leads. Microstrip does that with just a trace of calculated width on a dielectric board over a solid ground plane, so it is easy to fabricate as part of the PCB artwork. Its dimensions and the board's dielectric constant set the characteristic impedance, letting the designer match the MMIC input and output without extra hardware.
Watch out Miniature coax is the tempting answer since it is a controlled-impedance line too, but you cannot solder coax to chip-scale leads without launching problems; coax and waveguide are for getting signals between assemblies, not between devices on a board.
MMIC sits on a strip of board: microstrip. Impedance comes from trace width over the ground plane.
HamSandwich explanation, first draft. The question and answers are the NCVEC text.
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The rest of E6E

  1. E6E01 Why is gallium arsenide (GaAs) useful for semiconductor devices operating at UHF and higher frequencies?
  2. E6E02 Which of the following device packages is a through-hole type?
  3. E6E03 Which of the following materials supports the highest frequency of operation when used in MMICs?
  4. E6E04 Which is the most common input and output impedance of MMICs?
  5. E6E05 Which of the following noise figure values is typical of a low-noise UHF preamplifier?
  6. E6E06 What characteristics of MMICs make them a popular choice for VHF through microwave circuits?
  7. E6E07 What type of transmission line is often used for connections to MMICs?
  8. E6E08 How is power supplied to the most common type of MMIC?
  9. E6E09 Which of the following component package types have the least parasitic effects at frequencies above the HF r…
  10. E6E10 What advantage does surface-mount technology offer at RF compared to using through-hole components?
  11. E6E11 What is a characteristic of DIP packaging used for integrated circuits?
  12. E6E12 Why are DIP through-hole package ICs not typically used at UHF and higher frequencies?
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