Why DIP stands for Dual In-line Package: two rows of stiff pins that are pushed through holes drilled in the board and soldered on the opposite side. Through-hole parts like this are the classic mounting style, easy to socket and hand-solder. Every other package listed in this question is a surface-mount type whose leads or balls solder to pads on the same side of the board.
Watch out PLCC (plastic leaded chip carrier) is tempting because it has visible leads, but they are J-formed and reflow onto surface pads, not pushed through holes; BGA uses solder balls underneath and SOT is a tiny surface-mount transistor package.
DIP = pins 'dipped' through the board. If the name has 'chip carrier', 'grid array' or 'small outline', it is surface mount.